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502 oval LED

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period for delivery: Consignment Deadline Days
area: Guangdong
Expiry date : Long Effective
last update: 2019-04-21 11:29
view count: 182
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Product details

Product design (Unit:mm)

All dimension tolerance is ±0.2mm unless otherwise noted,Long foot is positive pole, short foot is negative pole.


Electro-OpticalCharacteristics

Absolute Maximum Ratings(Temperature=25℃)

Item

Symbol

Absolute Maximum Rating

Unit

Yellow

Forward Current

IF


20


20


mA

Peak Forward Current*

IFP


60


60


mA

Reverse Voltage

VR


5


5


V

Power Dissipation

PD


60


60


mW

Electrostatic discharge(HBM)

ESD


4000


2000


V

Operation Temperature

Topr


-25∽+80


-25∽+80


Storage Temperature

Tstg


-40∽+100


-40∽+100


Lead Soldering Temperature*

Tsol

Max. 260℃ for 5sec. Max.

Pulse Width≤10msec. and duty≤1/10


Electro-OpticalCharacteristics(Temperature=25)

Part Number

Lens color

Source

Color

Dominant Wavelength

λd/ nm

IF = 20mA

(Note8)

Luminous Intensity

Iv / mcd

IF = 20mA (Note 5)

Forward Voltage / V

IF = 20mA

Viewing Angle / Deg

(Note 6)




Min.

Typ.

Max.

Min.

Typ.

Max.

Min.

Typ.

Max.


502UYC

Color

Duffused

Yellow

585

---

595

12000

---

20000

1.8

---

2.4

15°±5°

Reverse Voltage = 5V

Reverse Current = 10µA


Notes:

1.Absolute maximum ratings Ta=25℃.

2.Tolerance of measurement of forward voltage±0.1V.

3.Tolerance of measurement of luminous intensity±15%.

4.Tolerance of measurement of the color coordinates is ±0.01

5.θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.It use many parameters that correspond to the CIE 1931 2°

Tolerance of measurement of angle is ±10 degree.

6.Caution in ESD: Static Electricity and surge damages the LED. lt is recommended to use a wrist band or anti-electrostatic glove when handling the LED.All devices, equipment and machinery must be properly grounded.

7. The dominant wavelength λd is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device.



Notes:

The data is for reference only, based on the actual shipment test.

The above is the actual test with the star test instrument


Notes for lamp beads

(1) Lead Forming

a. At least 3mm from the base of the epoxy bulb should be keep when forming leads.

b. Do not use the base of the leadframe as a fulcrum during lead forming.

Lead forming should be done before soldering.

c. Because the stress to the base may damage the characteristics or it may break the LEDs, do not apply any bending stress to the base of the lead

d. When mounting the LEDs onto a PCB, the holes on the circuit board should be exactly aligned with the leads of the LEDs. Stress at the leads should be avoid when the LEDs are mounted on the PCB, because it causes damage to the epoxy resin and this will degrade the LEDs.


(2) Storage

a. The LEDs should be stored at stored at 30 ℃ or less and 70%RH or less after being shipped and the storage life limits are 3 months.

b. If the LEDs are stored more then 3 months, they can be stored for a year in a sealed container with a nitrogen atmosphere and moisture absorbent material.

c. Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can occur.


(3) Static Electricity

a. Static electricity or surge voltage damages the LEDs.

b. It is recommended that a wristband or an anti-electrostatic glove be used when handling the LEDs.

c. All devices, equipment and machinery must be properly grounded.

d. It is recommended that measures be taken against surge voltage to the equipment that mounts the LEDs.

e. Damaged LEDs will show some unusual characteristics such as the leak current remarkably increases, the forward voltage becomes lower, or the LEDs do not light at the low current.

Criteria: (VF>2.0V at IF=0.5mA)


(4) Heat Generation

a. Thermal design of the end product was most importance. Please consider the heat generation of the LED when making the system design.

b. The thermal resistance of the circuit board and density of LED placement on the board, as well as other components was the important factor affecting the coefficient of temperature increase per input electric power. It must be avoid intense heat generation and operate within the maximum ratings given in the specification.

c. The operating current should be decided after considering the ambient maximum temperature of LEDs.


(5) Cleaning

a. It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the resin or not. Freon solvents should not be used to clean the LEDs because of worldwide regulations.

b. Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs would occur.


(6) Soldering Condition for LED Lamps

a Careful attention should be paid during soldering.

b. Solder the LED no closer than 3mm from the base of the epoxy bulb. Soldering beyond the base of the tie bar is recommender.

c. Recommender soldering conditions



Dip Soldering

Soldering

Pre-Heat

Pre-Heat Time

Solder Bath

Temperature

Dipping Time

Dipping Position

120°C Max

60 seconds Max

260°C Max

10 seconds Max

No lower than 3 mm from the base of the epoxy bulb.

Temperature

Soldering Time

Position

350°C Max

3 seconds Max

No closer than 3 mm from the base of the epoxy bulb.



d. Do not apply any stress to the lead particularly when heated.

The LEDs must not be repositioned after soldering.

After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until the LEDs return to room temperature.

Direct soldering onto a PC board should be avoided. Mechanical stress to the resin may be caused from warping of the PC board or from the clinching and cutting of the leadframes. When it is absolutely necessary, the LEDs may be mounted in this fashion but the User will assume responsibility for any problems. Direct soldering should only be done after testing has confirmed that no damage, such as wire bond failure or resin deterioration, will occur. FA HON LEDs should not be soldered directly to double sided PC boards because the heat will deteriorate the epoxy resin.

When it is necessary to clamp the LEDs to prevent soldering failure, it is important to minimize the mechanical stress on the LEDs.

Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures may cause failure of the LEDs.


(7) Others

a. Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum rating when using the LEDs with matrix drive. Keeping the Normal Forward to 20 mA.

b. The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances). Consult FA HON sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control systems, automobiles, traffic control equipment, life support systems and safety devices).

c. User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written consent from FA HON. When defective LEDs are found, the User shall inform FA HON directly before disassembling or analysis.

d. The formal specifications must be exchanged and signed by both parties before large volume purchase begins.

e. The appearance and specifications of the product may be modified for improvement without notice.


We focus on the cultivation and construction of LED big brands, do a good job in the LED brand display lamp bead supplier; do a good domestic LED big brand manufacturer; do a good job of LED green energy lighting manufacturer. The company has 20 years of experience in the industry, using the world's leading LED-Lamp production and packaging equipment, monthly production capacity of 100KK, per capita output value of one million.

http://www.tranch-led.com/

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